Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Including passive device
Reexamination Certificate
2008-08-04
2010-06-08
Quach, Tuan N. (Department: 2893)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
Including passive device
C438S379000, C438S383000, C257SE21352
Reexamination Certificate
active
07732293
ABSTRACT:
A diode structure fabrication method. In a P− substrate, an N+ layer is implanted. The N+ layer has an opening whose size affects the breakdown voltage of the diode structure. Upon the N+ layer, an N− layer is formed. Then, a P+ region is formed to serve as an anode of the diode structure. An N+ region can be formed on the surface of the substrate to serve as a cathode of the diode structure. By changing the size of the opening in the N+ layer during fabrication, the breakdown voltage of the diode structure can be changed (tuned) to a desired value.
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Canale Anthony J.
International Business Machines - Corporation
Quach Tuan N.
Schmeiser Olsen & Watts
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