Liquid adhesive from phenoplast and m-aminophenol

Chemistry of carbon compounds – Miscellaneous organic carbon compounds

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Details

260 292EP, 260 297N, 260 515, 260833, 260846, C08L 6114

Patent

active

040123502

ABSTRACT:
The strength of the bond obtained between substrates with the aid of phenoplasts, modified phenoplasts and/or epoxy resins, e.g. between fibrous material and an elastomer on vulcanization thereof, is improved by applying, to at least one of the substrates, in addition to a preformed phenoplast, modified preformed phenoplast, and/or preformed epoxy resin, and drying thereon before the assembly thereof with the other substrate, as an adhesion promoter, a quantity of m-aminophenol, which may be blended in a phenoplast adhesive, such as an RF dip or an RFL dip, or may be blended in the elastomer latex used for forming an RFL dip. Adhesive/promoter blends and latex/promoter blends for forming the same are also disclosed.

REFERENCES:
patent: 3018207 (1962-01-01), Danielson
patent: 3507689 (1970-04-01), Freytag
patent: 3698935 (1972-10-01), Yurcick et al.
patent: 3719724 (1973-03-01), Freeman

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