Manufacturing method and manufacturing apparatus of printed...

Details Manufacturing method and manufacturing apparatus of printed... Manufacturing method and manufacturing apparatus of printed...

2006-09-28

2010-11-02

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

Reexamination Certificate

active

07823762

ABSTRACT:
A solder ball is loaded on a bump having a small height (FIG.5(B)) and the height of the bump is intensified by melting the solder ball by heating with laser (FIG.5(C)). Thus, the heights of the bumps are adjusted within a requested allowable range. Because the bump is not removed by heating when the height of the low bump is intensified, the printed wiring board is not subjected to local heat history thereby intensifying reliability of the bump of a printed wiring board.

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