Light-emitting diode device and method for fabricating the same

Details Light-emitting diode device and method for fabricating the same Light-emitting diode device and method for fabricating the same

2008-10-15

2010-10-05

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C438S237000, C438S328000, C438S979000, C257S098000, C257S367000, C257S594000, C257S656000

Reexamination Certificate

active

07807484

ABSTRACT:
A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a light-emitting diode chip disposed thereon. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the light-emitting diode chip. In one embodiment, the lens module comprises a glass substrate having a first cavity formed at a first surface thereof, a fluorescent layer formed over a portion of a first surface exposed by the first cavity, facing the light-emitting diode chip, and a molded lens formed over a second surface of the glass carrier opposing to the first surface.

REFERENCES:
patent: 2004/0136197 (2004-07-01), Ishida
patent: 2007/0263403 (2007-11-01), Yatsuda et al.
patent: 2009/0127567 (2009-05-01), Wang

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