Method for the production of a hole and device

Details Method for the production of a hole and device Method for the production of a hole and device

2004-09-02

2010-10-19

Paik, Sang Y (Department: 3742)

Electric heating

Metal heating

By arc

C219S121730

Reexamination Certificate

active

07816625

ABSTRACT:
Previous methods for the production of a hole in a component are very time-consuming and expensive, as special lasers having ultra short laser pulse lengths are used. The inventive method varies laser pulse lengths and ultra short laser pulse lengths are used exclusively in the region which is to be removed, wherein it is possible to have a noticeable influence on through flow and/or out-flow behavior. This, for example, the inner surface of a diffuser of a hole, which can be produced in a precise manner using ultra short laser pulse lengths.

REFERENCES:
patent: 5073687 (1991-12-01), Inagawa et al.
patent: 5683600 (1997-11-01), Kelley et al.
patent: 5841099 (1998-11-01), Owen et al.
patent: 5939010 (1999-08-01), Yuyama et al.
patent: 6054673 (2000-04-01), Chen
patent: 6172331 (2001-01-01), Chen
patent: 6359254 (2002-03-01), Brown
patent: 6479788 (2002-11-01), Arai et al.
patent: 6541731 (2003-04-01), Mead et al.
patent: 6573474 (2003-06-01), Loringer
patent: 6630645 (2003-10-01), Richter et al.
patent: 6809291 (2004-10-01), Neil et al.
patent: 6864459 (2005-03-01), Chang et al.
patent: 2004/0169022 (2004-09-01), Mega et al.
patent: 2004/0173942 (2004-09-01), Kobayashi et al.
patent: 100 63 309 (2002-07-01), None
patent: 1 386 689 (2004-02-01), None
patent: 05 138380 (1993-06-01), None
patent: WO 02/092276 (2002-11-01), None

Affiliated with

Also associated with

Rating

Method for the production of a hole and device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for the production of a hole and device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the production of a hole and device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4241966