Module including a rough solder joint

Details Module including a rough solder joint Module including a rough solder joint

2008-03-31

2010-10-26

Mandala, Victor A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257SE21476, C257SE23141, C257S751000, C438S612000

Reexamination Certificate

active

07821130

ABSTRACT:
A module includes a metallized substrate including a metal layer, a base plate, and a joint joining the metal layer to the base plate. The joint includes solder contacting the base plate and an inter-metallic zone contacting the metal layer and the solder. The inter-metallic zone has spikes up to 100 μm and a roughness (Rz) of at least 20 μm.

REFERENCES:
patent: 5701034 (1997-12-01), Marrs
patent: 6844621 (2005-01-01), Morozumi et al.
patent: 2003/0132271 (2003-07-01), Kao et al.
patent: 2008/0230905 (2008-09-01), Guth et al.
patent: 2009/0134501 (2009-05-01), Ganitzer et al.
patent: 10 2004 054 063 (2006-06-01), None
“Further Improvements in the Reliability of IGBT Modules”, Thomas Schutze, et al., eupec GmbH & Co., (4 pgs.), Jan. 1998.
“Improving the Thermal Reliability of Large Area Solder Joints in IGBT Power Modules”, Dr. Karsten Guth, Infineon Technologies AG, (5 pgs.), 2006.
“Joint Industry Standard”, IPC/JEDEC J-STED-020C, Jul. 2004 (20 pgs.).

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