Flexible encapsulant materials for micro-fluid ejection...

Details Flexible encapsulant materials for micro-fluid ejection... Flexible encapsulant materials for micro-fluid ejection...

2007-03-13

2010-10-26

Do, An H (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

Reexamination Certificate

active

07819506

ABSTRACT:
Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

REFERENCES:
patent: 5561176 (1996-10-01), Garafalo et al.
patent: 6255738 (2001-07-01), Distefano et al.

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