Method of forming an ink supply channel

Details Method of forming an ink supply channel Method of forming an ink supply channel

2009-08-17

2010-11-23

Olsen, Allan (Department: 1716)

Etching a substrate: processes

Forming or treating thermal ink jet article

Reexamination Certificate

active

07837887

ABSTRACT:
A method of forming an ink supply channel for an inkjet printhead comprises the steps of: (i) providing a wafer having a frontside and a backside; (ii) etching a plurality of frontside trenches into the frontside; (iii) filling each of the trenches with a photoresist plug; (iv) forming nozzle structures on the frontside using MEMS fabrication processes; (v) etching a backside trench from the backside, the backside trench meeting with one or more of the plugs; (vi) removing a portion of each photoresist plug via the backside trench by subjecting the backside to a biased oxygen plasma etch, thereby exposing sidewall features in the backside trench; (vii) modifying the exposed sidewall features; and (viii) removing the photoresist plugs to form the ink supply channel. The ink supply channel connects the backside to the frontside.

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patent: WO 01/022481 (2001-03-01), None
patent: WO 02/015249 (2002-02-01), None

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