Method using a carrier for manufacturing a memory device and...

Details Method using a carrier for manufacturing a memory device and... Method using a carrier for manufacturing a memory device and...

2007-06-25

2010-06-15

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S238000, C438S381000, C257SE21497, C257SE21499, C257SE21509, C257SE21645

Reexamination Certificate

active

07736947

ABSTRACT:
A carrier including a bottom plate, an intermediate cover, and a top cover for manufacturing a memory device is introduced herein. A printed circuit board is disposed on the bottom plate, and memory elements are arranged and disposed on the PCB. The intermediate cover is used to press peripheral regions of the printed circuit board, and to expose the regions where the memory elements are formed on the printed circuit board. The printed circuit board is closely attached to a surface of the bottom plate by fixing the intermediate cover. The top cover is used to cover the memory elements formed on the printed circuit board after some manufacturing processes, and by exerting an external force, the formed memory elements are clamped down, so as to protect the memory elements from being affected by the printed circuit board in the following thermal process due to the thermal stress deformation.

REFERENCES:
patent: 4953460 (1990-09-01), Wojcik
patent: 5129573 (1992-07-01), Duffey
patent: 5277749 (1994-01-01), Griffith et al.
patent: 5804248 (1998-09-01), Hewett
patent: 6096131 (2000-08-01), Hewett

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