Microencapsulatable solvent adhesive composition and method for

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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4283215, 42840221, 524315, 524365, 524366, C08K 910, B32B 326

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active

058772367

ABSTRACT:
A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.

REFERENCES:
patent: 2988461 (1961-06-01), Eichel
patent: 3378420 (1968-04-01), Dickinson et al.
patent: 3489599 (1970-01-01), Kriehle
patent: 3686701 (1972-08-01), Charle et al.
patent: 3811980 (1974-05-01), Roderhoff
patent: 3814156 (1974-06-01), Bachmann et al.
patent: 3821060 (1974-06-01), Braca et al.
patent: 3922373 (1975-11-01), Bayless
patent: 4073946 (1978-02-01), Bayless
patent: 4107071 (1978-08-01), Bayless
patent: 4200480 (1980-04-01), Wolinski et al.
patent: 4207697 (1980-06-01), Murphy
patent: 4377621 (1983-03-01), Hart et al.
patent: 4536524 (1985-08-01), Hart et al.
patent: 4672084 (1987-06-01), Dierdorf et al.
patent: 4865938 (1989-09-01), Sakai et al.
patent: 5297819 (1994-03-01), Harder
patent: 5384345 (1995-01-01), Naton
patent: 5416142 (1995-05-01), Bush et al.

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