System and method for assembling and interconnecting...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S729000, C029S830000, C029S831000, C029S832000

Reexamination Certificate

active

07856705

ABSTRACT:
A process for mechanical assembly and electrical interconnection of the functional components of an active implantable medical device. A first step involves preparing an interconnection flex circuit (20) that is able to be electrically and mechanically linked to an electronic circuit module (14), a supply battery (12) and a series of feedthrough terminals (16) of the device, prior to being placed in a common case. The flex circuit has a series of pads (34) for linking to homologous metallizations (46) of the substrate. The mechanical assembling and electrical linking of these pads (34) to the metallizations (46) is performed without either the use of any activation flux or introduction of fusible brazing, and rather by applying an intermediate anisotropic conductive material (38) placed between the pads (34) and metallizations (46), followed by polymerizing this material. The applying and polymerizing are performed under controlled conditions of pressure, temperature and duration.

REFERENCES:
patent: 5386341 (1995-01-01), Olson et al.
patent: 6109530 (2000-08-01), Larson et al.
patent: 6245092 (2001-06-01), Schaldach, Jr.
patent: 6642613 (2003-11-01), Nguyen et al.
patent: 7134194 (2006-11-01), Brandenburg et al.
Pei Siang S L, et al., “Process Development of a Flip Chip in Package with Anisotropic Conductive Film (ACF) for Lead-free Soldering”, 2004 Electronics Packaging Technology Conference, Singapore.
Maattanen J, et. al., “Development of Fine Pitch (54 [mu]m) Flip Chip On Flex Interconnection Process”, IEEE Polytronic 2002 Conference.
Kisiel R, “Lead-free Technologies For Electronic Equipment Assembly”, Warsaw University of Technology, Warszawa, Poland, Proc. Of SPIE vol. 5125.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and method for assembling and interconnecting... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for assembling and interconnecting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for assembling and interconnecting... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4228243

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.