Method and device for monitoring a heat treatment of a...

Semiconductor device manufacturing: process – With measuring or testing

Reexamination Certificate

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Reexamination Certificate

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07846749

ABSTRACT:
A method of monitoring a heat treatment of a microtechnological substrate includes placement of the substrate to be treated in a heating zone and applying a heat treatment to the substrate, under predetermined temperature conditions, while monitoring the change over the course of time in the vibratory state of the substrate, and detecting a fracture in the substrate by detecting a peak characteristic in the vibratory state over the course of time.

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patent: 2004-179566 (2004-06-01), None
Machine Translation of JP 2004-179566.
International Search Report, Mar. 6, 2008.
French Written Opinion, Mar. 6, 2008.

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