MEMS shock sensors

Measuring and testing – Testing by impact or shock – Specimen impactor detail

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07810373

ABSTRACT:
A shock sensor comprises a substrate and at least one flexure coupled to the substrate and configured to deflect upon an application of force to the shock sensor sufficient to deflect the flexure. Deflection of the at least one flexure produces a detectable change in an electrical property of the shock sensor. Examples of detectable changes in an electrical property of the shock sensor include an open circuit condition, a closed circuit condition, and a variation in voltage of a piezo-electric detector. In some embodiments, the change in the electrical property of the shock sensor may be remotely read by interrogation of a radio frequency identification transponder positioned on the substrate using a remote radio frequency identification transceiver. The disclosure also relates to a shock sensing system and method of shock detection.

REFERENCES:
patent: 2666409 (1954-01-01), Kane
patent: 4641539 (1987-02-01), Vilimek
patent: 4683355 (1987-07-01), Bitko
patent: 4862298 (1989-08-01), Genheimer et al.
patent: 5144845 (1992-09-01), Pyke
patent: 5747761 (1998-05-01), Masuda
patent: 5856895 (1999-01-01), Schaenzer et al.
patent: 6079088 (2000-06-01), Schaenzer
patent: 6199874 (2001-03-01), Galvin et al.
patent: 6318176 (2001-11-01), McKenzie et al.
patent: 6619123 (2003-09-01), Gianchandani et al.
patent: 6629448 (2003-10-01), Cvancara
patent: 6938334 (2005-09-01), Yu
patent: 6975476 (2005-12-01), Berding
patent: 7038150 (2006-05-01), Polosky et al.
patent: 7266988 (2007-09-01), Kranz et al.
patent: 7289009 (2007-10-01), Christenson et al.
patent: 7350424 (2008-04-01), Hjelt et al.
patent: 7404338 (2008-07-01), Hierold et al.
patent: 7493815 (2009-02-01), Younis
patent: 2004/0000713 (2004-01-01), Yamashita et al.
patent: 2005/0223812 (2005-10-01), Denis
patent: 2006/0009251 (2006-01-01), Noda et al.
Wang et al., “Design, Fabrication, and Measurement of High-Sensitivity Piezoelectric Microelectromechanical Systems Accelerometers,” Journal of Microelectromechanical Systems, Aug. 2003, pp. 433-439, vol. 12, No. 4.
U.S. Appl. No. 11/348,930, titled “Magnetic MEMS Device,” filed Feb. 7, 2006.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

MEMS shock sensors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with MEMS shock sensors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MEMS shock sensors will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4227168

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.