Method of mounting an electronic component and mounting...

Details Method of mounting an electronic component and mounting... Method of mounting an electronic component and mounting...

2007-12-14

2010-11-09

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Using high frequency vibratory energy

C228S180220, C228S207000, C228S223000

Reexamination Certificate

active

07828193

ABSTRACT:
In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.

REFERENCES:
patent: 5409155 (1995-04-01), Chen
patent: 5427301 (1995-06-01), Pham et al.
patent: 5603444 (1997-02-01), Sato
patent: 5655700 (1997-08-01), Pham et al.
patent: 5730832 (1998-03-01), Sato et al.
patent: 5884831 (1999-03-01), Sato et al.
patent: 5992729 (1999-11-01), Koopman et al.
patent: 6053395 (2000-04-01), Sasaki
patent: 6202915 (2001-03-01), Sato
patent: 6798072 (2004-09-01), Kajiwara et al.
patent: 7154206 (2006-12-01), Shimada et al.
patent: 7367486 (2008-05-01), Kostiew
patent: 2005/0001014 (2005-01-01), Takeuchi et al.
patent: 2005/0098610 (2005-05-01), Onobori et al.
patent: 2006/0091184 (2006-05-01), Bayot et al.
patent: 362217638 (1987-09-01), None
patent: 07-115109 (1995-05-01), None
patent: 411163199 (1999-06-01), None
patent: 2000-174059 (2000-06-01), None
patent: 2005-026579 (2005-01-01), None
patent: 2005-209833 (2005-08-01), None

Affiliated with

Also associated with

Rating

Method of mounting an electronic component and mounting... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of mounting an electronic component and mounting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of mounting an electronic component and mounting... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4225980