Solid-state imaging device and method for manufacturing the...

Details Solid-state imaging device and method for manufacturing the... Solid-state imaging device and method for manufacturing the...

2006-08-23

2010-02-09

Menz, Douglas M (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S458000

Reexamination Certificate

active

07659183

ABSTRACT:
A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be manufactured with a high yield ratio are provided.The solid-state imaging device includes at least a silicon layer formed with a photo sensor portion and a wiring layer formed on the front-surface side of the silicon layer, and in which light L is made to enter from the rear-surface side opposite to the front-surface side of the silicon layer and the thickness of the silicon layer4is 10 μm or less. Also, the method for manufacturing the solid-state imaging device at least includes the steps of: forming a semiconductor region of a photo sensor portion in a silicon layer of a layered substrate in which a silicon substrate, an intermediate layer and a silicon layer are laminated; bonding a first supporting substrate onto the silicon layer; removing the silicon substrate and the intermediate layer; forming thereafter a wiring portion above the silicon layer; bonding a second supporting substrate onto the wiring portion, and removing the first supporting substrate to make the silicon layer exposed.

REFERENCES:
patent: 06-077461 (1994-03-01), None
patent: 06-283702 (1994-10-01), None
patent: 2003-031785 (2003-01-01), None
patent: 2003-078826 (2003-03-01), None
patent: 2003-273343 (2003-09-01), None
Japanese Office Action dated Jul. 10, 2007.

Affiliated with

Also associated with

Rating

Solid-state imaging device and method for manufacturing the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solid-state imaging device and method for manufacturing the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solid-state imaging device and method for manufacturing the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4225800