Dressing a wafer polishing pad

Details Dressing a wafer polishing pad Dressing a wafer polishing pad

2007-06-29

2010-12-07

Eley, Timothy V (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S010000, C451S021000, C451S056000

Reexamination Certificate

active

07846006

ABSTRACT:
A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.

REFERENCES:
patent: 5664987 (1997-09-01), Renteln
patent: 5690544 (1997-11-01), Sakurai
patent: 5961377 (1999-10-01), Jeong
patent: 6113462 (2000-09-01), Yang
patent: 6302762 (2001-10-01), Inaba et al.
patent: 6309277 (2001-10-01), Arcayan et al.
patent: 6371836 (2002-04-01), Brown et al.
patent: 6607423 (2003-08-01), Arcayan et al.
patent: 6875086 (2005-04-01), Golzarian et al.
patent: 6896583 (2005-05-01), Rodriquez et al.
patent: 6910947 (2005-06-01), Paik
patent: 6939208 (2005-09-01), Kamimura et al.
patent: 6976907 (2005-12-01), Golzarian et al.
patent: 7033253 (2006-04-01), Dunn
patent: 2003/0190873 (2003-10-01), Wang et al.
patent: 2004/0023602 (2004-02-01), Moloney et al.
patent: 2005/0164613 (2005-07-01), Seike et al.

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