Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2009-08-19
2010-11-23
Mulpuri, Savitri (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000, C257S712000, C257S713000, C257S717000, C257S718000, C257SE21497, C257SE21499, C257SE21508, C257SE21514, C361S688000, C361S704000, C361S705000, C361S707000
Reexamination Certificate
active
07838988
ABSTRACT:
A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.
REFERENCES:
patent: 4764804 (1988-08-01), Sahara et al.
patent: 7566590 (2009-07-01), Zhong et al.
patent: 2006/0237839 (2006-10-01), Akram et al.
patent: 2008/0164603 (2008-07-01), Sturcken et al.
patent: 2008/0265385 (2008-10-01), Tsai et al.
Gupta Vikas
Gurrum Siva Prakash
Sahasrabudhe Kapil Heramb
Ahmadi Mohsen
Brady III Wade J.
Mulpuri Savitri
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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