Semiconductor device having channel with cooling fluid and...

Details Semiconductor device having channel with cooling fluid and... Semiconductor device having channel with cooling fluid and...

2009-07-08

2010-06-22

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE23096, C257SE23102

Reexamination Certificate

active

07741159

ABSTRACT:
A semiconductor device includes a semiconductor substrate, a first diffusion region formed in the semiconductor substrate, a semiconductor element formed in the first diffusion region, and a channel formed in the first diffusion region to receive a cooling fluid.

REFERENCES:
patent: 5395802 (1995-03-01), Kiyota et al.
patent: 5998240 (1999-12-01), Hamilton et al.
patent: 6768182 (2004-07-01), Oyamatsu et al.
patent: 2003/0102510 (2003-06-01), Lim et al.

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