Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

2007-08-09

2010-02-23

Thai, Luan C (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S780000, C257S779000, C257SE23021, C257SE23023

Reexamination Certificate

active

07667336

ABSTRACT:
A semiconductor device provided with a semiconductor chip wherein an electrode pad is formed on a circuit formation surface, includes a first passivation film, which serves as an adhering layer; a second passivation film formed on the first passivation film, for protecting the semiconductor chip from external physical damage; a metal film formed so as to cover at least a first electrode-pad opening section of the first passivation film; and an external connection terminal to connect the electrode pad to an external equipment. A second electrode-pad opening section of the second passivation film is formed so as to expose the first electrode-pad opening section entirely. The second passivation film is formed so as not to be in direct contact with the electrode pad.

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