Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reissue Patent
2007-04-19
2010-06-08
Ho, Tu-Tu V (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S760000, C257SE23069, C257SE21512, C257SE23135, C438S623000, C438S464000, C438S465000
Reissue Patent
active
RE041369
ABSTRACT:
A semiconductor device includes at least one semiconductor structure having a plurality of external connection portions on an upper surface, and an insulating member which is made of a resin containing reinforcing materials and arranged on a side of the semiconductor structure. An insulating film is formed on the upper surface of the semiconductor structure, except the external connection portions, and on an upper surface of the insulating member. A plurality of upper wirings each of which has a connection pad portion are located on an upper side of the insulating film and electrically connected to a corresponding one of the external connection portions of the semiconductor structure. The connection pad portion of at least one of the upper wirings is arranged above an upper surface of the insulating member.
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O et al., JP 2002-246756, Multilayer printed-wiring board and its manufacturing method, pubn-date: Aug. 30, 2002, machine translation.
Casio Computer Co. Ltd.
Frishauf Holtz Goodman & Chick P.C.
Ho Tu-Tu V
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