Heat dissipation package for heat generation element

Details Heat dissipation package for heat generation element Heat dissipation package for heat generation element

2007-11-07

2010-10-19

Ho, Tu-Tu V (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257S099000, C257S675000, C257S693000, C257S712000, C257S713000, C257SE33056, C257SE33075, C257SE23083, C257SE23102, C257SE23104

Reexamination Certificate

active

07816698

ABSTRACT:
A heat dissipation package is provided. Conducting leads of the package are located between two dissipating parts of a heat dissipation carrier to form the heat dissipation package with a structure of heat outside and electricity inside. Consequently, there is no limitation caused by electrical elements surrounding the heat dissipation carrier, so as to enhance the expandability of the heat dissipation carrier and improve the efficiency for heat dissipation of the heat generation element.

REFERENCES:
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patent: 2006/0131591 (2006-06-01), Sumitani
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patent: 2517112 (2002-10-01), None
“1st Office Action of China counterpart application”, issued on Jul. 17, 2009, p. 1-p. 6.

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