Method and system for high-speed, precise micromachining an...

Details Method and system for high-speed, precise micromachining an... Method and system for high-speed, precise micromachining an...

2006-05-02

2010-02-23

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S460000, C219S121690, C257SE21599

Reexamination Certificate

active

07666759

ABSTRACT:
A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.

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