Alkaline etchant for controlling surface roughness of...

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S745000, C438S750000, C216S090000

Reexamination Certificate

active

07851375

ABSTRACT:
An alkali etchant for controlling surface roughness of a semiconductor wafer, which is a sodium hydroxide solution or a potassium hydroxide solution having a weight concentration of 55 wt % to 70 wt %.

REFERENCES:
patent: 5880027 (1999-03-01), Hajime et al.
patent: 6099748 (2000-08-01), Netsu et al.
patent: 6530381 (2003-03-01), Schwab et al.
patent: 7338904 (2008-03-01), Koyata et al.
patent: 2004/0072437 (2004-04-01), Iizuka et al.
patent: 2004/0108297 (2004-06-01), Erk et al.
patent: 2005/0139230 (2005-06-01), Miyata et al.
patent: 2006/0240748 (2006-10-01), Ohta et al.
patent: 2007/0184658 (2007-08-01), Koyata et al.
patent: 63-221967 (1988-09-01), None
patent: 7-037871 (1995-02-01), None
patent: 9-129624 (1997-05-01), None
patent: 9-270396 (1997-10-01), None
patent: 9-270397 (1997-10-01), None
patent: 9-306897 (1997-11-01), None
patent: 4-10110115 (1998-04-01), None
patent: 11-162953 (1999-06-01), None
patent: 11-171693 (1999-06-01), None
patent: 2001-185529 (2001-07-01), None
patent: 2002-203823 (2002-07-01), None
patent: 2002-203824 (2002-07-01), None
patent: 2003-7672 (2003-01-01), None
patent: 2003-229392 (2003-08-01), None
patent: 2004-262975 (2004-09-01), None
English language abstract of JP 2003-229392 A.
English language abstract of JP 9-306897 A.
English language abstract of JP 63-221967 A.
English language abstract of JP 2001-185529 A.
English language abstract of JP 2002-203824 A.
English language abstract of JP 2003-7672 A.
English language abstract of JP 11-171693 A.
English language abstract of JP 11-162953 A.
U.S. Appl. No. 10/596,177, filed Jun. 2, 2006.
Japanese Office Action dated Aug. 18, 2009 that issued with respect to Japanese Patent Application No. 2005-022764, along with an English language translation.
Office Action mailed Apr. 21, 2010 with respect to U.S. Appl. No. 11/688,041.
Office Action mailed Nov. 6, 2009 with respect to U.S. Appl. No. 11/688,041.
Office Action mailed Jul. 12, 2010 with respect to U.S. Appl. No. 11/688,041.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Alkaline etchant for controlling surface roughness of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Alkaline etchant for controlling surface roughness of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Alkaline etchant for controlling surface roughness of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4217420

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.