Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2009-01-12
2010-12-21
Nguyen, Donghai D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C174S262000
Reexamination Certificate
active
07854062
ABSTRACT:
A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.
REFERENCES:
patent: 4372804 (1983-02-01), Hanabusa et al.
patent: 6010768 (2000-01-01), Yasue et al.
patent: 6120693 (2000-09-01), Petti et al.
patent: 6432748 (2002-08-01), Hsu
patent: 6570098 (2003-05-01), Shimizu et al.
patent: 6912779 (2005-07-01), Naitoh et al.
patent: 2006/0001166 (2006-01-01), Igarashi et al.
patent: 06-177295 (1994-06-01), None
patent: 09-321432 (1997-12-01), None
patent: 2001-339151 (2001-12-01), None
patent: 2002-185097 (2002-06-01), None
patent: 2004-63722 (2004-02-01), None
patent: 2004-140176 (2004-05-01), None
Igarashi Yusuke
Mizuhara Hideki
Nakamura Takeshi
Takakusaki Nobuhisa
Usui Ryosuke
Fish & Richardson P.C.
Nguyen Donghai D.
Sanyo Electric Co,. Ltd.
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