Heat dissipation device and computer using same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S679520, C361S679540, C361S703000, C361S704000, C361S709000, C165S080500, C165S104330, C165S185000, C174S015200, C174S016300

Reexamination Certificate

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07839630

ABSTRACT:
A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is polyurethane foam.

REFERENCES:
patent: 4636425 (1987-01-01), Johnson et al.
patent: 5510954 (1996-04-01), Wyler
patent: 6351382 (2002-02-01), Nakanishi et al.
patent: 6570086 (2003-05-01), Shimoji et al.
patent: 6859364 (2005-02-01), Yuasa et al.
patent: 6880626 (2005-04-01), Lindemuth et al.
patent: 7292441 (2007-11-01), Smalc et al.
patent: 7606036 (2009-10-01), Hwang et al.
patent: 7637632 (2009-12-01), Wang et al.
patent: 7663883 (2010-02-01), Shirakami et al.
patent: 2005/0036290 (2005-02-01), Yang et al.
patent: 2005/0168941 (2005-08-01), Sokol et al.
patent: 2005/0180113 (2005-08-01), Shirakami et al.
patent: 2007/0068659 (2007-03-01), Hwang et al.
patent: 2007/0272395 (2007-11-01), Hwang et al.
patent: 2008/0151503 (2008-06-01), Aapro et al.
patent: 2009/0044927 (2009-02-01), Hwang et al.
patent: 2010/0127301 (2010-05-01), Chen
patent: 11202978 (1999-07-01), None
patent: 2009115396 (2009-05-01), None
patent: WO 2008043206 (2008-04-01), None

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