Glue for packaging light emitting diode and use thereof

Details Glue for packaging light emitting diode and use thereof Glue for packaging light emitting diode and use thereof

2008-09-22

2010-10-19

Gulakowski, Randy (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S477000, C528S030000, C528S031000, C528S032000, C528S033000

Reexamination Certificate

active

07816463

ABSTRACT:
A glue for packaging a light emitting diode (LED) is described and includes a first set of compositions and a second set of compositions mixed based on a predetermined weight ratio. The first set of compositions is poly(dimethyl siloxane), and the second set of compositions includes a copolymer of dimethyl siloxane, methyl hydrogen siloxane, and vinyl siloxane. The copolymer in the second set of compositions has a weight percentage from about 94% to 99%, dimethyl siloxane in the copolymer has a weight percentage from about 84% to 90%, methyl hydrogen siloxane in the copolymer has a weight percentage from about 4% to 9%, and vinyl siloxane in the copolymer has a weight percentage from about 2% to 7%. A use of the glue for packaging a LED is also described.

REFERENCES:
patent: 7291670 (2007-11-01), Fehn et al.
patent: 2002/0119111 (2002-08-01), Kilgour et al.

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