Bundled wire device

Details Bundled wire device Bundled wire device

2008-11-26

2010-11-02

Mayo, III, William H (Department: 2831)

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

C174S07400A, C174S078000

Reexamination Certificate

active

07825332

ABSTRACT:
A bundled wire device having a first stranded wire, a second stranded wire, and a stranded copper ground wire, wherein the wires are simultaneously coated with a mesh sheath. The mesh sheaths allow heat from the first stranded wire, second stranded wire, and the stranded copper wire to dissipate. The bundled wire device has a third stranded wire also surrounded by the mesh sheath.

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patent: 2006/0146456 (2006-07-01), Williams

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