Semiconductor package with mechanical stress isolation of...

Details Semiconductor package with mechanical stress isolation of... Semiconductor package with mechanical stress isolation of...

2008-04-16

2010-10-26

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257SE23135, C257SE21504, C257S783000, C257S676000, C257S680000, C257S668000, C257S784000, C257S786000, C257S684000, C257S796000

Reexamination Certificate

active

07821117

ABSTRACT:
A semiconductor package (20) includes an organic substrate (24) and a semiconductor die subassembly (22). A method (50) for making the semiconductor package (20) entails providing (52) the organic substrate (24) having an opening (26) and electrical contacts (36). The subassembly (22) is formed by producing (64) a semiconductor die (28) and bonding it to a platform layer (30). An elastomeric adhesive (38) is utilized (92) to secure the subassembly (22) in the opening (26). Electrical interconnects (32) are provided (106) between the semiconductor die (28) and the electrical contacts (36) of the organic substrate (24). The organic substrate (24), semiconductor die (28), elastomeric adhesive (38), and electrical interconnects (32) are encapsulated (114) in a packaging material (46). The elastomeric adhesive (38) provides mechanical anchoring of the subassembly (22) to the substrate (24) and provides mechanical stress isolation of the semiconductor die (28) within the semiconductor package (20).

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