Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-12-10
2010-12-07
Phan, Thiem (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S831000, C029S832000, C438S046000, C438S093000, C438S455000
Reexamination Certificate
active
07845073
ABSTRACT:
A method of manufacturing a circuit board embedding a thin film capacitor, the method including: forming a sacrificial layer on a first substrate; forming a dielectric layer on the sacrificial layer; forming a first electrode layer on the dielectric layer; disposing the first substrate on the second substrate in such a way that the first electrode layer is bonded to a top of a second substrate; decomposing the sacrificial layer by irradiating a laser beam onto the sacrificial layer through the first substrate; separating the first substrate from the second substrate; and forming a second electrode layer on the dielectric layer.
REFERENCES:
patent: 5261153 (1993-11-01), Lucas
patent: 6071795 (2000-06-01), Cheung et al.
patent: 6541137 (2003-04-01), Kingon et al.
patent: 6887770 (2005-05-01), Ueda et al.
patent: 6964201 (2005-11-01), Xu et al.
patent: 2006/0076584 (2006-04-01), Kim et al.
patent: 2004-260176 (2004-09-01), None
patent: 2005-039234 (2005-02-01), None
patent: 2005-252308 (2005-09-01), None
patent: 10-2006-0067188 (2006-06-01), None
Japanese Office Action, w/ English translation thereof, issued in Japanese Patent Application No. JP 2007-321378 dated Mar. 9, 2010.
Chung Yul Kyo
Kim Bae Kyun
Lee In Hyung
Lee Jung Won
Lee Seung Eun
McDermott Will & Emery LLP
Phan Thiem
Samsung Electro-Mechanics Co. Ltd.
LandOfFree
Method of manufacturing circuit board embedding thin film... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing circuit board embedding thin film..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing circuit board embedding thin film... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4200100