Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-10-05
2010-11-23
Levi, Dameon E (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S763000, C361S764000, C361S783000, C174S262000, C174S264000, C174S266000
Reexamination Certificate
active
07839649
ABSTRACT:
A circuit board structure with an embedded semiconductor element and a fabrication method thereof are disclosed according to the present invention. The circuit board structure comprises: a carrier board having a first surface, a second surface, and at least one through hole penetrating the carrier board from the first surface to the second surface; a first semiconductor element received in the through hole and having an active surface and an inactive surface, the active surface having a plurality of electrode pads; at least one second semiconductor element mounted on the carrier board; a first encapsulation layer formed on the first surface of the carrier board to block one end of the through hole; and a second encapsulation layer formed on the second surface of the carrier board.
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Levi Dameon E
Nguyen Hoa C
Sawyer Law Group P.C.
Unimicron Technology Corp.
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