LSI package provided with interface module, and transmission...

Details LSI package provided with interface module, and transmission... LSI package provided with interface module, and transmission...

2008-04-04

2010-02-23

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257SE23141

Reexamination Certificate

active

07667311

ABSTRACT:
An LSI package encompasses a transmission line header embracing a header-base, a transmission line held by the header-base, and an interface IC chip mounted on the header-base, an interposer substrate having a plurality of board-connecting joints, which facilitate connection with the printed wiring board; an LSI chip mounted on the interposer substrate; and a receptacle having a lead terminal and being mounted on the interposer substrate, configured to accommodate the transmission line header so that the interface IC chip electrically connects to the LSI chip through the lead terminal.

REFERENCES:
patent: 6906407 (2005-06-01), Byers et al.
patent: 7352935 (2008-04-01), Furuyama et al.
patent: 7-22594 (1995-04-01), None
patent: 2000-183370 (2000-06-01), None
patent: 2001-91174 (2001-04-01), None
patent: 2001 -313438 (2001-11-01), None
patent: 2001-318283 (2001-11-01), None
patent: 2004-87790 (2004-03-01), None
“Investigation of an Optical Transmission Line such as an Optical Waveguide or Free-Space Optical Interconnection Advances”, Nikkei Electronics, No. 810, Dec. 3, 2001, pp. 121-122 (with Partial English Translation).

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