Solid state lighting apparatus utilizing axial thermal...

Details Solid state lighting apparatus utilizing axial thermal... Solid state lighting apparatus utilizing axial thermal...

2008-10-29

2010-06-22

Ton, Anabel M (Department: 2875)

Illumination

Light source and modifier

With ventilating, cooling or heat insulating means

C362S373000, C362S249020, C362S800000

Reexamination Certificate

active

07740380

ABSTRACT:
A solid state lighting apparatus characterized by its compact, predominately axial form factor, utilizes an axial thermal transfer member constructed of Highly Oriented Pyrolytic Graphite (HOPG) to aid in the dissipation of waste heat generated during its operation. The lighting apparatus is chiefly comprised of a Light Emitting Diode (LED) die array and circuit structure assembly affixed to one end of the axial thermal transfer member and further includes a transversely mounted heat sink structure, running the length of, and being affixed to, opposite sides of the axial member. The axial member serves to distribute waste heat down its length, and simultaneously, into a transverse plane where the waste heat is dissipated into the transversely mounted heat sink structure. A fan may be utilized to evacuate the waste heat out of the lighting apparatus and into the ambient environment.

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patent: 2009/0097241 (2009-04-01), Xu et al.

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