Method for soldering with a multistep temperature profile

Details Method for soldering with a multistep temperature profile Method for soldering with a multistep temperature profile

2009-06-17

2010-11-16

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Specific rate of varying temperature or schedule of distinct...

C228S245000

Reexamination Certificate

active

07832620

ABSTRACT:
In soldering processes according to prior art, there is often an insufficient tie-up to a substrate of a component. A method in which no voids occur during the soldering processes is provided. A temperature pattern is proposed according to the method in which the temperature is lowered successively during the soldering operation.

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