Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-07-09
2010-11-16
Nguyen, Donghai D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S831000, C029S890030, C257S714000, C361S699000
Reexamination Certificate
active
07832096
ABSTRACT:
A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels formed thereon. A permanent solder mask is laminated over the cut-out channels to form thermal dissipation channels, which are in fluid communication with input and output ports. The C4 solder joints include solder balls that electronically connect terminals on the chips to corresponding attach pads on the substrate that are exposed through the mask. The thermal dissipation channels extend along rows of attach pads. A cooling fluid, such as inert perfluorocarbon fluid, flows through the thermal dissipation channels to remove heat and to mitigate strain on the solder balls due to coefficient of thermal expansion (CTE) mismatch between the chips and the substrate.
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Kuczynski Joseph
Sinha Arvind Kumar
Bussan Matthew J.
International Business Machines - Corporation
Nguyen Donghai D.
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