Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2007-04-30
2010-11-16
Quach, Tuan N. (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S737000, C257S738000, C257SE23079
Reexamination Certificate
active
07834449
ABSTRACT:
Methods, systems, and apparatuses for wafer-level integrated circuit (IC) packages are described. An IC package includes an IC chip, an insulating layer on the IC chip, a plurality of vias, a plurality of routing interconnects, and a plurality of bump interconnects. The IC chip has a plurality of terminals configured in an array on a surface of the IC chip. A plurality of vias through the insulating layer provide access to the plurality of terminals. Each of the plurality of routing interconnects has a first portion and a second portion. The first portion of each routing interconnect is in contact with a respective terminal of the plurality of terminals though a respective via, and the second portion of each routing interconnect extends over the insulating layer. Each bump interconnect of the plurality of bump interconnects is connected to the second portion of a respective routing interconnect of the plurality of routing interconnects.
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Kaufmann Matthew V.
Tan Teck Yang
Broadcom Corporation
Fiala & Weaver P.L.L.C.
Quach Tuan N.
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