Camera module, method of manufacturing the same, and printed...

Details Camera module, method of manufacturing the same, and printed... Camera module, method of manufacturing the same, and printed...

2007-03-23

2010-02-23

Fuller, Rodney E (Department: 2862)

Photography

Camera detail

Lens mount

C396S542000

Reexamination Certificate

active

07665915

ABSTRACT:
A camera module, including a printed circuit board, an image sensor chip, and a housing, is provided. A plating line can be formed in an inner layer of the printed circuit board. A method of manufacturing the camera module can include connecting the plating line of the inner layer of the printed circuit board to a pattern of an outer layer using a via hole, performing a plating process, and forming an image sensor, the housing, and a lens part on the printed circuit board.

REFERENCES:
patent: 6916685 (2005-07-01), Yang et al.
patent: 7065869 (2006-06-01), Kang et al.
patent: 2006/0098969 (2006-05-01), Asai et al.
patent: 2006/0202349 (2006-09-01), Higashida et al.
patent: 2007/0122146 (2007-05-01), Ryu
patent: 2007/0269205 (2007-11-01), Lee et al.
patent: 2008/0164550 (2008-07-01), Chen et al.
patent: 04-357683 (1994-07-01), None

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