Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-12-22
2010-10-26
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S724000, C257S777000, C257S782000, C257SE21614, C361S748000, C361S784000, C361S792000, C438S109000, C438S125000
Reexamination Certificate
active
07821122
ABSTRACT:
A method and system for fabricating a interconnect substrate for a multi-component package is disclosed. The multi-component package includes at least one die and a package substrate. The method and system include providing an insulating base and providing at least one conductive layer. The at least one conductive layer provides interconnects for at least one discrete component. The interconnect substrate is configured to be mounted on the at least one die and to have the at least one discrete component mounted on the interconnect substrate.
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Atmel Corporation
Chambliss Alonzo
Schwegman Lundberg & Woessner, P.A.
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