Thermal sensors for stacked dies

Details Thermal sensors for stacked dies Thermal sensors for stacked dies

2007-12-24

2010-12-14

Zweizig, Jeffrey S (Department: 2816)

Miscellaneous active electrical nonlinear devices, circuits, and

External effect

Temperature

Reexamination Certificate

active

07852138

ABSTRACT:
The invention relates to a method for obtaining temperature values from at least two thermal sensors arranged on resources within a three-dimensional die structure determining at least a partial three-dimensional temperature distribution for said die structure and controlling activity of said resources of said dies in response to said three-dimensional temperature distribution.

REFERENCES:
patent: 6996491 (2006-02-01), Gold et al.
patent: 2003/0102556 (2003-06-01), Moriguchi et al.
patent: 2005/0231925 (2005-10-01), Fukuda et al.
patent: 2006/0265174 (2006-11-01), Doyle et al.
patent: 2007/0145578 (2007-06-01), Lee
International Search Report for International Application No. PCT/IB2007/004090.
Written Opinion of the International Searching Authority for International Application No. PCT/IB2007/004090.

Affiliated with

Also associated with

Rating

Thermal sensors for stacked dies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal sensors for stacked dies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal sensors for stacked dies will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4178650