Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate
2008-04-25
2010-10-26
Richards, N Drew (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
C257S685000, C257S708000, C257S717000, C257SE23101
Reexamination Certificate
active
07821125
ABSTRACT:
The invention provides a heat radiating structure which reduces a mechanical stress applied to an electronic part mounted on a printed circuit board including a semiconductor package. The heat radiating structure is constructed by a semiconductor package mounted on a printed circuit board, a thermal conduction sheet arranged on an upper surface of the semiconductor package, and a metal case provided with a heat radiating fin for receiving a heat transmitted form the thermal conduction sheet so as to discharge to an atmospheric air, and the metal case is provided with a concavo-convex structure in a contact portion with the thermal conduction sheet.
REFERENCES:
patent: 6087682 (2000-07-01), Ando
patent: 7514784 (2009-04-01), Mayuzumi et al.
patent: 2001-068607 (2001-03-01), None
patent: 2004-259977 (2004-09-01), None
patent: 2006-261336 (2006-09-01), None
Maeda Fumihide
Matsue Hiroo
Tokita Shigeru
Brundidge & Stanger, P.C.
Garcia Joannie A
OpNext Japan, Inc.
Richards N Drew
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