Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-01-05
2010-02-02
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C174S260000
Reexamination Certificate
active
07656677
ABSTRACT:
A multilayer electronic component includes a multilayer substrate having a first main surface and a second main surface, a resin layer having a mounting surface and a contact surface bonded to the first main surface, a via conductor provided inside the resin layer, and an external terminal electrode disposed on the mounting surface so as to come in contact with the via conductor. The external terminal electrode has a first region on a main surface facing the mounting surface and a second region on a main surface facing away from the mounting surface. The first region is connected to the via conductor while the second region is provided with a bonding member. The second region is arranged such that, when the first region is projected through to the main surface facing away from the mounting surface, the second region is spaced from and does not overlap with a region in which the first region is projected.
REFERENCES:
patent: 6153448 (2000-11-01), Takahashi et al.
patent: 6538210 (2003-03-01), Sugaya et al.
patent: 6815810 (2004-11-01), Takehara et al.
patent: 6828669 (2004-12-01), Iijima et al.
patent: 6838765 (2005-01-01), Hyodo et al.
patent: 6866255 (2005-03-01), Fork et al.
patent: 2003/0071350 (2003-04-01), Takehara et al.
patent: 2003/0141105 (2003-07-01), Sugaya et al.
patent: 2008/0258283 (2008-10-01), Shimoto et al.
patent: 2009/0008790 (2009-01-01), Lee et al.
patent: 2009/0008792 (2009-01-01), Ko et al.
patent: 09-199635 (1997-07-01), None
patent: 10-313074 (1998-11-01), None
patent: 2001-244638 (2001-09-01), None
patent: 2003-124435 (2003-04-01), None
patent: 2003-309213 (2003-10-01), None
Ogawa Nobuaki
Sakai Norio
Keating & Bennett LLP
Murata Manufacturing Co. Ltd.
Reichard Dean A.
Semenenko Yuriy
LandOfFree
Multilayer electronic component and structure for mounting... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer electronic component and structure for mounting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer electronic component and structure for mounting... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4172529