Heat sink unit, circuit board unit, and electronic device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S690000, C361S695000, C361S697000, C174S016100, C174S016300, C165S080300, C165S122000

Reexamination Certificate

active

07733656

ABSTRACT:
A heat sink unit includes: a cooling member including a metal plate having a plurality of attachment holes on edges thereof, a first surface of the metal plate adjoining a heat-producing electronic component, and a second surface of the metal plate having a plurality of cooling fins erected on an area other than the attachment holes. The heat sink unit further includes: an attachment member including an opening in which the cooling fins are disposed when the cooling member is installed and a plurality of threaded bosses protruding from the first surface to be inserted into each of the attachment holes; and coil springs into which the bosses are respectively inserted. The coil springs are interposed between the attachment member and the metal plate, and the bosses are inserted into the attachment holes to fix the cooling member by screws.

REFERENCES:
patent: 6023413 (2000-02-01), Umezawa
patent: 6442025 (2002-08-01), Nakamura et al.
patent: 6606254 (2003-08-01), Yoneda
patent: 6654247 (2003-11-01), Lee
patent: 6671177 (2003-12-01), Han
patent: 6738254 (2004-05-01), Oogami
patent: 6765794 (2004-07-01), Inoue
patent: 7184265 (2007-02-01), Kim et al.
patent: 7397666 (2008-07-01), Barsun et al.
patent: 7580265 (2009-08-01), Kumagai et al.
patent: 0 856 888 (1998-08-01), None
patent: 10-70383 (1998-03-01), None
patent: 10-223816 (1998-08-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat sink unit, circuit board unit, and electronic device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink unit, circuit board unit, and electronic device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink unit, circuit board unit, and electronic device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4171997

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.