Contact pad structure for flip chip semiconductor die

Details Contact pad structure for flip chip semiconductor die Contact pad structure for flip chip semiconductor die

2006-10-26

2010-10-26

Lee, Calvin (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C438S613000

Reexamination Certificate

active

07821133

ABSTRACT:
A flip chip Schottky die is provided, which includes three contact bumps extending from a top surface of the die for electrically connecting with a board, a first and second bump being cathode contacts, and a third bump being an anode contact and having a larger surface than each of the first and second bumps for a 0.5 ampere device. Each bump is substantially rectangular at its base, but may have a curved or arched top surface on a square die. Also, provided is a contact bump useful in a flip chip device, such as a MOSFET or diode for a current of 1.0 amperes that includes a solder body of PbSn or a solder body free of lead comprising SnAgCu. Such a contact bump is substantially rectangular, and a height of approximately 120 μm.

REFERENCES:
patent: 6617237 (2003-09-01), Lee et al.
patent: 6933221 (2005-08-01), Jiang
patent: 7023027 (2006-04-01), Teramae et al.
patent: 7129558 (2006-10-01), Skocki
patent: 7315669 (2008-01-01), Ohtorii
patent: 7358174 (2008-04-01), Mis
patent: 7505239 (2009-03-01), Kanazawa et al.
patent: 2002/0020551 (2002-02-01), Rinne et al.
patent: 2004/0021233 (2004-02-01), Kinzer et al.
patent: 2004/0084770 (2004-05-01), Skocki
patent: 2005/0006789 (2005-01-01), Tomono et al.

Affiliated with

Also associated with

Rating

Contact pad structure for flip chip semiconductor die does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Contact pad structure for flip chip semiconductor die, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Contact pad structure for flip chip semiconductor die will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4171671