Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-04-23
2010-06-15
Bui, Hung S (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C174S260000, C174S261000
Reexamination Certificate
active
07738256
ABSTRACT:
Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These components are connected to conductive patterns formed on wiring layers, with connecting vias therebetween. Contact faces of each component with the connecting vias are controlled so as to be disposed at the same level with the metal layers.
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Miyazaki Masashi
Sawatari Tatsuro
Aychillhum Andargie M
Bui Hung S
Law Office of Katsuhiro Arai
Taiyo Yuden Co., Ltd
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