Imaging device by buried photodiode structure

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

Reexamination Certificate

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C257S225000, C257S233000, C257SE27133

Reexamination Certificate

active

07842978

ABSTRACT:
An n-type region as a charge storage region of a photodiode is buried in a substrate. The interface between silicon and a silicon oxide film is covered with a high concentration p-layer and a lower concentration p-layer is formed only in the portion immediately below a floating electrode for signal extraction. Electrons generated by light are stored in the charge storage region, thereby changing the potential of the portion of the p-layer at the surface of the semiconductor region. The change is transmitted through a thin insulating film to the floating electrode by capacitive coupling and read out by a buffer transistor. Initialization of charges is executed by adding a positive high voltage to the gate electrode of a first transfer transistor such that the electrons stored in the charge storage region are transferred to the n+region and generation of reset noise is protected.

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U.S. Appl. No. 12/516,635, filed May 28, 2009, Kawahito.
U.S. Appl. No. 12/065,156, filed Feb. 28, 2008, Kawahito, et al.
U.S. Appl. No. 12/065,158, filed Feb. 28, 2008, Kawahito, et al.

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