Wiring board and method for manufacturing the same, and...

Details Wiring board and method for manufacturing the same, and... Wiring board and method for manufacturing the same, and...

2007-04-30

2010-12-07

Patel, Ishwarbhai B (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000

Reexamination Certificate

active

07847198

ABSTRACT:
A wiring board includes an insulating base; an adhesive layer formed on the surface of the insulating base; a conductor wiring formed on the surface of the adhesive layer; and a bump formed crossing the longitudinal direction of the conductor wiring over regions on the adhesive layer on both sides of the conductor wiring, wherein the back face at a part of the conductor wiring where the bump is formed, and the back faces and parts of the side faces of the bump formed above the regions of the adhesive layer on both sides of the conductor wiring, are embedded in the surface of the adhesive layer so as to be adhered to the adhesive layer. Even when the wiring width of the conductor wiring is decreased, the conductor wiring can be adhered to the wiring board firmly.

REFERENCES:
patent: 5296649 (1994-03-01), Kosuga et al.
patent: 6734566 (2004-05-01), Honda
patent: 6914200 (2005-07-01), Higuchi et al.
patent: 7304249 (2007-12-01), Lee et al.
patent: 2004/0212969 (2004-10-01), Imamura et al.
patent: 2003-243455 (2003-08-01), None

Affiliated with

Also associated with

Rating

Wiring board and method for manufacturing the same, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring board and method for manufacturing the same, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring board and method for manufacturing the same, and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4160123