Semiconductor chip and method of manufacturing the same

Details Semiconductor chip and method of manufacturing the same Semiconductor chip and method of manufacturing the same

2006-06-29

2010-11-30

Le, Thao X (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S774000, C257S700000, C257SE23151, C257SE23168

Reexamination Certificate

active

07843068

ABSTRACT:
A semiconductor chip includes a semiconductor substrate11, a through via12provided in a through hole17that passes through the semiconductor substrate11, insulating layers21-1to21-3laminated on the semiconductor substrate11, a multi-layered wiring structure14having a first wiring pattern22and a second wiring pattern23, and an external connection terminal15provided on an uppermost layer of the multi-layered wiring structure14, wherein the through via12and the external connection terminal15are connected electrically by the second wiring pattern23.

REFERENCES:
patent: 6444576 (2002-09-01), Kong
patent: 6882045 (2005-04-01), Massingill et al.
patent: 2002/0109236 (2002-08-01), Kim et al.
patent: 2004/0108587 (2004-06-01), Chudzik et al.
patent: 0907206 (1999-04-01), None
patent: 64-023564 (1989-01-01), None
patent: 05-029483 (1993-02-01), None
patent: 09-064050 (1997-03-01), None
patent: 2001-060654 (2001-03-01), None
patent: 2001-326326 (2001-11-01), None
patent: 2005-294582 (2005-10-01), None
patent: 2006-041450 (2006-02-01), None
patent: 2005/101475 (2005-10-01), None
patent: 2005/101476 (2005-10-01), None
patent: 2006/019156 (2006-02-01), None

Affiliated with

Also associated with

Rating

Semiconductor chip and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4160046