Microelectronic package and method of cooling an...

Details Microelectronic package and method of cooling an... Microelectronic package and method of cooling an...

Filed on

2007-09-26

Date issued

2010-12-14

Examiner

Parekh, Nitin (Department: 2811)

Patent Class

Active solid-state devices (e.g., transistors, solid-state diode

SubClass

Housing or package

SubSubClass

With provision for cooling the housing or its contents

Other Related Categories

C257S778000, C257S930000, C257SE23082, C257S713000

Type

Reexamination Certificate

Status

active

Patent number

07851905

Description

ABSTRACT:
A microelectronic package comprises a substrate (110, 310), a die (320) supported by the substrate, an interconnect feature (130, 230, 330) connecting the die and the substrate to each other, and a thermoelectric cooler (140, 170, 240, 340) adjacent to the interconnect feature.

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