Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-09-26
2010-12-14
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S778000, C257S930000, C257SE23082, C257S713000
Reexamination Certificate
active
07851905
ABSTRACT:
A microelectronic package comprises a substrate (110, 310), a die (320) supported by the substrate, an interconnect feature (130, 230, 330) connecting the die and the substrate to each other, and a thermoelectric cooler (140, 170, 240, 340) adjacent to the interconnect feature.
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Chiu Chia-Pin
Chrysler Gregory M.
Mahajan Ravi V.
Intel Corporation
Nelson Kenneth A.
Parekh Nitin
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