Method for severing brittle material substrate and severing...

Details Method for severing brittle material substrate and severing... Method for severing brittle material substrate and severing...

2003-04-01

2010-12-14

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

C438S068000, C438S113000, C438S115000, C438S458000, C438S460000

Reexamination Certificate

active

07851241

ABSTRACT:
There are provided a scribing step of performing scribing in a state in which a protective material is applied on at least one surface of a brittle material substrate, and a first scribing device that performs this scribing step. Accordingly, it is possible to form a vertical crack that reaches deep inside of the substrate, while effectively removing cullets produced at the time of severing the substrate, thus performing precise severing along a scribe line.

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