Semiconductor module including semiconductor chips in a...

Details Semiconductor module including semiconductor chips in a... Semiconductor module including semiconductor chips in a...

2006-03-27

2010-11-02

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23180, C257SE21500, C438S125000

Reexamination Certificate

active

07825506

ABSTRACT:
A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.

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