Plated material and electric and electronic parts using the...

Details Plated material and electric and electronic parts using the... Plated material and electric and electronic parts using the...

2008-08-19

2010-11-02

Zimmerman, John J (Department: 1794)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S675000, C428S676000, C428S687000, C428S929000, C439S886000, C439S887000, C148S537000, C427S383700, C427S123000, C205S226000, C205S228000

Reexamination Certificate

active

07824776

ABSTRACT:
A plated material5, containing: on a conductive substrate1, an underlayer2composed of nickel and the like; an intermediate layer3composed of Cu or a Cu alloy being provided thereon; and an outermost layer4composed of a Cu—Sn intermetallic compound being provided thereon; and an electric or electronic part using the same.

REFERENCES:
patent: 4441118 (1984-04-01), Fister et al.
patent: 6083633 (2000-07-01), Fister et al.
patent: 6336979 (2002-01-01), Sugawara et al.
patent: 6755958 (2004-06-01), Datta
patent: 6759142 (2004-07-01), Hara et al.
patent: 2003/0091855 (2003-05-01), Tanaka et al.
patent: 2003/0186597 (2003-10-01), Suzuki et al.
patent: 2004/0258556 (2004-12-01), Kim et al.
patent: 2005/0048308 (2005-03-01), Mucklich et al.
patent: 2008/0090096 (2008-04-01), Suzuki et al.
patent: 1 203 654 (2002-05-01), None
patent: 11-135226 (1999-05-01), None
patent: 2000-21545 (2000-01-01), None
patent: 2000-212720 (2000-08-01), None
patent: 2000-226645 (2000-08-01), None
patent: 2003-82499 (2003-03-01), None
patent: 2003-213486 (2003-07-01), None
patent: 2004-68026 (2004-03-01), None
patent: 2004-179055 (2004-06-01), None
patent: 2004-300524 (2004-10-01), None
patent: 2004-339555 (2004-12-01), None
patent: 2005-105419 (2005-04-01), None
patent: 2005-307240 (2005-11-01), None
Chinese Office Action issued on Dec. 18, 2009 in corresponding Chinese application No. 2007800058528 (with English translation).

Affiliated with

Also associated with

Rating

Plated material and electric and electronic parts using the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plated material and electric and electronic parts using the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plated material and electric and electronic parts using the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4157692